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[China]Direct Bond Copper / DBC ceramic Substrate

DBC Ceramic Substrate

DBC(Direct Bond Copper) Substrate are used a special process in which the copper foil and the Al2O3 are directly bonded under appropriate high temperature, which applications are power semiconductor modules, thermoelectric cooling modules, electronic heating devices, power control circuits, power hybrid circuit.

Benefits

High mechanical strength,mechanicallly stable shape
Better thermal cycling capabilities, high reliability.
Environmentally friendly


Additional information:

Place of origin:China
Brand:ELECERAMIC
Price:1 USD
Price Terms:FOB
Packing:VACUUM
Delivery time:30 days
Minimum order:500
Quality/Certifications:ISO9001:2000

Category: Electronics, electrical engineering -> Electronics -> Components



ELE Advanced Ceramics

Street:R/2302 Dihao Building, #820 Xiahe Road
City:Xiamen
Postal code:361004
Country:China
Phone: +86 592 2960185
Fax: +86 592 2960178

Internet

Presentation:www.eleceramic.maxtrader.eu

Contact person

Name and Surname: James Qiu
Phone: +86 592 2960185